Dymax

Light-Curing Solutions for Spacecraft and Unmanned Electronics

Dymax develops UV/LED light-curing adhesives, conformal coatings, and maskants for electronics and optical assemblies used in unmanned systems, satellites, aerospace avionics, and defense hardware. These one-part, fast-curing light-curing solutions support tight process control and rapid stabilization of components, while meeting key aerospace standards such as ASTM E595 low outgassing, MIL-STD-883 ionic cleanliness, and additional IPC and defense-grade requirements.

Dymax one-part, eco-friendly products are used in applications such as:

• PCB protection and conformal coating
• Optical bonding and optical positioning
• Camera module assembly and active alignment of lenses
• PCB masking prior to coating or finishing
• Ruggedizing, staking, wire tacking, and encapsulation

UV/LED cure in seconds enables efficient throughput and reliable assembly of electronics exposed to vibration, thermal cycling, and vacuum environments.

Light-Cure Conformal Coatings

Reliable Protection of Aerospace & Defense Electronics Exposed to Challenging Environments

Dymax conformal coatings cure in seconds enabling rapid PCB component and board-level protection without extended oven cycles or solvent-driven processes. Fast cure reduces handling time and stabilizes delicate assemblies quickly, supporting high-throughput electronics production.

Coatings provide moisture, dust, and corrosion resistance for electronics exposed to wide temperature ranges, atmospheric cycling, and mechanical stress. Secondary heat-cure options ensure complete curing in shadowed regions. Low-outgassing formulations, such as Dymax 9771, help prevent condensable contamination in optical and vacuum environments. The MAPTIS-listed coating is suitable for spacecraft and high-altitude electronics requiring long-term stability.

The conformal coatings adhere to FR-4, glass, metal, ceramic, and other common PCB substrates and meet key aerospace and defense standards, including ASTM E595 and multiple IPC and MIL specifications.

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Light-Curable Assembly Adhesives

Solutions for PCB Ruggedizing, Optical Bonding, and Precision Alignment

Dymax assembly adhesives are engineered for precise, fast assembly of optical and electronic components. These light-curing solutions offer low shrinkage, low outgassing, and excellent thermal-cycle resistance, attributes essential for satellite payloads, defense optics, and UAV imaging systems.

MAPTIS-listed low-outgassing adhesive for PCB component reinforcement

Dymax 9773 provides verified ASTM E595 and MIL-STD-883 Method 5011 performance for assemblies exposed to vacuum and contamination-sensitive environments. Its high viscosity enables controlled deposit profiles for staking and ruggedizing without slumping (up to 72 hours on vertical surfaces), while the low-outgassing chemistry helps maintain optical and electrical stability in spacecraft and aerospace electronics.

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Adhesives for optical positioning, camera module assembly, and active alignment

Dymax 9801 and 9803 are formulated for applications where bond-line movement directly impacts focal accuracy and sensor alignment. Their low shrinkage minimizes post-cure dimensional change, preserving optical calibration, and fast UV/LED cure “locks in” alignment exactly when the system reaches its target optical position. These adhesives support lens-to-barrel bonding, sensor attachment, module reinforcement, and active alignment processes used in high-resolution imaging systems.

More information: Light-Curable Assembly Adhesives

SpeedMask® Maskants

Reworkable PCB Maskants for Conformal Coating and Precision Processes

SpeedMask maskants provide clean, efficient masking for PCB keep-out zones during conformal coating, soldering, and finishing processes. They conform to complex geometries and cure instantly under UV/Visible light, enabling precise masking without labor-intensive tapes, lacquers, or manual rework.

The cured maskants peel cleanly without residue after proper cure, eliminating the risk of contamination on connectors, gold fingers, or sensitive components. Single-layer application by dipping, spraying, or screen printing supports scalable automation and one-part chemistry aligns with clean manufacturing requirements common in aerospace and unmanned system production.

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